By Francoise Von Trapp On Jul. 09, 2009
Welcome to the first day of the 3D Brightspots IC forum. This first round of questions across the topics is directed to all the panelists. Are standards necessary for the adoption of 3D integration schemes? Read More>>
By Francoise Von Trapp On Jul. 09, 2009
Paul, in your opinion as an equipment manufacturer, what has been delaying the implementation of 3D IC technology in high-volume manufacturing? Read More>>
By Francoise Von Trapp On Jul. 06, 2009
What are the business aspects of 3D integration processes that need to be considered when deciding which approaches will be best for volume production? Read More>>
By Francoise Von Trapp On Jul. 09, 2009
Welcome to the first day of the 3D Brightspots IC forum. This first round of questions across the topics is directed to all the panelists. Post fab processes are identified as backgrinding (thinning), bonding, microbumping and stacking. In your opinion, should these processed fall to the fabs, OSATS or another party?  Read More>>
By Francoise Von Trapp On Jul. 09, 2009
Contact issues, known good die, and quality assurance have all been identified as test issues that need to be addressed with 3D ICs.  Bob and/or Sitaram,  can you offer your perspective on how 3D ICs should be tested, and what difficulties does this present? Read More>>