By Francoise Von Trapp On Jul. 06, 2009
What problems does 3D solve, and why is it better than just scaling? Read More>>
By Francoise Von Trapp On Jul. 09, 2009
Lack of design tools has been identified as one of the current roadblocks to market adoption. Ricardo, from your perspective as a member of the design tool community, what new capabilities are required of EDA tools in order to support 3D IC design? Read More>>
By Francoise Von Trapp On Jul. 06, 2009
Welcome to the first day of the 3D Brightspots IC forum. This first round of questions across the topics is directed to all the panelists. Where do you see 3D IC in regards to its position along the technology innovation and adoption curve? Read More>>
By Francoise Von Trapp On Jul. 09, 2009
Paul, in your opinion as an equipment manufacturer, what has been delaying the implementation of 3D IC technology in high-volume manufacturing? Read More>>
By Francoise Von Trapp On Jul. 07, 2009
Will equipment need to be standardized to take 3D integration with TSVs to volume production?  If so, who will determine what these standards should be, and how will it affect equipment suppliers who have already invested in developing equipment for  3D processes? Paul - since you're the equipment guy on the panel, perhaps you'd like to start this off. Read More>>